Check with seller Package Substrates are the Backbone of Semiconductor Packaging Shenzhen
- Location: Shenzhen, Shenzhen, Guangdong
Absolutely, package substrates are indeed crucial components in semiconductor packaging. They serve as the foundation on which semiconductor devices are built, providing electrical connections between the chip and the outside world while also offering mechanical support and heat dissipation.
These substrates are typically made of materials like FR-4 (a type of fiberglass-reinforced epoxy laminate), ceramics, or more advanced materials like silicon, depending on the specific requirements of the application. The choice of substrate material depends on factors such as cost, performance, and the intended use of the semiconductor device.
Contact info:- https://efpcb.weebly.com/blog/package-substrates-are-the-backbone-of-semiconductor-packaging
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