Check with seller IC Packaging Substrates: The Backbone of Integrated Circuits Shenzhen
- Location: Shenzhen, Shenzhen, Guangdong
Composed Circuit (IC) substrates are the foundation materials used in IC packaging substrates to get and work with relationship between the IC and the followed network on the PCB. These substrates consolidate different layers, a supporting community in the center, an association of drill openings, and guide pads, making them harder to deliver than standard PCBs.
Contact info:- https://efpcb.wordpress.com/2024/10/30/ic-packaging-substrates-the-backbone-of-integrated-circuits/
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