Check with seller FCBGA packaging substrate Shenzhen
- Location: Shenzhen, Shenzhen, Guangdong
FCBGA, or Flip-Chip Ball Grid Array, is a type of packaging substrate utilized in semiconductor devices. It's a variation of the traditional BGA (Ball Grid Array) packaging. FCBGA packaging substrate involves mounting the silicon die facedown (hence the term "flip-chip") onto the substrate. This configuration allows for direct electrical connections between the die and the substrate using solder bumps.
Contact Info:-
High Quality PCB Co., Limited
Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China
Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China
Plant 2 address: Zhuhai, Guangdong, China
Plant 3 address: Dongguan, Guangdong, China
TEL: +86-755-23724206
WahtsApp: +86-189 2381 2997
Skype: shawnwang2006
Email: sales@efpcb.com
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